Heat Sink Attach Of Flip Chip System

Design to Flip Chip Process, our Heat Sink Attach Systems are used to pick and place the heat sink accurately onto the flip chip. The systems has high accuracy of placements and normally use to enclosed the flip chip packages.

Below are the models and its specifications :

2010T	2010S
2030T

System feature Linear Servo for speed and repeatability 2µm Single picker for high speed mounting Laser sensor for Height check function Easy programmable control Placement accuracy 50µm Force limit 10kgf/cm²
System specification Attach placement accuracy (X-Y) : ±50µm Ø axis accuracy : ±0.1° (AC - servo motor) Z-axis accuracy : ±25µm Attach Bonding Force : 1gr ~10kgf/cm² Vision system accuracy : RVSI series ±0.013mm Inspection System : COGNEX 8000 Series UPH 680 - 750 EA (PRO-2010S)

Heat Sink Attach Process System Flow

Input		Inspection (Dispensing)

	H/S-Pick up		H/S-Alignment

	H/S-Attach		Output

Products substrate of Heat Sink